Live ChatFUJIFILM PRESCALE
Pressure measurement film
THERMOSCALE
Heat distribution measurement film
Example uses of PRESCALE / THERMOSCALE for parts manufacturing
A – Camera Modules
Pressure
Heat
Check Contact and heat distribution during ACF bonding
B – Semiconductor wafers
Pressure
Heat
Uniform pressure and check heat distribution when wafers are joined
B – Ceramic laminated device filter
Pressure
Heat
Check contact of molds for laminators
Check uniform pressure and heat distribution for laminators
B – Print circuit boards
Pressure
Squeegee pressure distribution measurement during cream solder printing
Check dry film resist (DFR) laminated nip pressure and heat distribution
B – Semiconductor chips
Pressure
Die collect adjustmet for die bonding
C – Li-ion batteries
Pressure
Heat
Check nip pressure and heat distribution for electrode plate press
Check aluminum laminate film crimping equipment conctact and heat distribution (Heat sealing)
Check contact for cathodes/separators/anode laminating equipment
Other parts
Flash memory
- Check balancing during multilayer circuit board mounting process
- Adjusting the molds when manufacturing the semiconductor package
Crystal transducers
- Check contact when cutting crystal
- Adjusting the cutting equipment
Connectors
- Check contact for injection molding machine molds
Utilizing PRESCALE in LCDs, touch panel manufacturing and the smartphone assembly process
Prescale measurement results
- AFC Bonding
- OCA/cover glass lamination
- Backlight lamination – smartphone lamination
- Lithium-ion battery electrode plate press
Utilizing THERMOSCALE in LCDs, touch panel manufacturing and the smartphone assembly process
Use THERMOSCALE for processes that use heat to check the distribution
- Check rough heat distribution during ACF bonding
- Check the wiring pattern and heat loss during circuit board design
LCD Process
- Polarization plate lamination Pressure
- Driver IC ACF bonding Pressure Heat
- Backlight Lamination Pressure
- Small and medium LCD modules Pressure
Smartphone Assembly Process
- ACF Bonding Pressure Heat
- OCA Lamination Pressure
Touch Panel Process
- Controller IC ACF bonding Pressure Heat
- Touch panel / OCA lamination Pressure
- Touch panel / cover glass lamination Pressure