Article: Bodo's Power Systems
Reduce Dry Film Resist Lamination Defects
Pressurex® film from Sensor Products Inc. is a quick, accurate and economical way to detect and correct pressure variations in the lamination of dry film resist to the board substrate. When placed between nip rollers in the lamination press, the film instantaneously and permanently changes color directly proportional to the actual pressure applied.
With Pressurex®, variations in pressure that can lead to defects are easily detected and corrected — decreasing scrap, improving yield, and increasing productivity.
Even, consistent bonding of the thin layer of photoresist is critical to the board’s subsequent electrical performance. The photoresist material is placed on the board’s surface using a hot roller system. If the rollers do not exert uniform pressure across the board’s surface, the thin photoresist layer can fail to adhere, bubble or even wrinkle during the process. This causes electrical instability and possible failure of the resulting board.
Pressurex® Film Reveals the Nip Roller Pressure Profile
in the PCB Lamination Press