by Aleksandar Petreski | Sep 26, 2023
Article Pressure Control in Flip Chip Assembly 182k Related Links Research Articles Surface Pressure Mapping Sensors George A. Riley, PhD FlipChips Dot Com A recent conference paper showed the advantages of a pressure-indicating film in wafer-to-wafer bonding (Ref 1)....
by Aleksandar Petreski | Sep 26, 2023
Article Evaluation of Megasonic Cleaning Systems for Particle Removal… 171k Related Links Research Articles Surface Pressure Mapping Sensors G. Vereecke*, F. Holsteyns, J. Veltens1, M. Lux, S. Arnauts, K. Kenis, R. Vos, P.W. Mertens, and M.M. Heyns IMEC,...
by Aleksandar Petreski | May 1, 2015
Article Download PDF Related Links Research Articles Wafer Bonding Wafer Polishing G Byrne, E Ahearne, and P Timoney* Advanced Manufacturing Science Research Centre, University College Dublin, Dublin, Ireland The manuscript was received on 1 June 2010 and was accepted...
by Aleksandar Petreski | Feb 1, 2010
Article Thermal compression wafer bonding of tungsten applied to fabrication… 436k Related Links Research Articles Wafer Bonding Y. Zhou a, S. Sridhar a, K.C. Mishra b, D. Klotzkin c,* a Electrical and Computer Engineering Department, University of Cincinnati,...
by Aleksandar Petreski | Oct 1, 2009
Article Pressure Indicating Film Characterization of Pressure… 287k Related Links Research Articles Surface Pressure Mapping Sensors D. Spicer1, K. Lai1, K. Kornelsen1, A. Brennan1, N. Belov2, M. Wang2, T-K. Chou3, J. Heck3, T. Zhu2, S. Akhlaghi1 1Micralyne...
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