by Aleksandar Petreski | Jul 1, 2009
Article New Pressure Sensitive Device to Measure and Predict Package Drops 738k Related Links Research Articles Surface Pressure Mapping Sensors S. PAUL SINGH1,*, JAY SINGH2 and YOUNG PAEK3 1Professor, School ofPackaging, Michigan State University, East...
by Aleksandar Petreski | May 1, 1999
May, 1999 General Information This technical service bulletin discusses the set-up of thermocompression bonding equipment to be used with 3M Z-Axis Bonding Film in the interconnection of flexible circuits to printed circuit boards (PCB), ITO/glass LCD circuits or...
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