Wafer Bonding

Fujifilm Prescale^® Film Placed Between a Wafer Bonding Interface

Fujifilm Prescale^® is a unique, affordable and easy to use tool that reveals the distribution and magnitude of pressure in your wafer bonder.

Fujifilm Prescale^® is used to measure pressure on wafer bonding machines to reveal pressure inconsistencies across the wafer surface. By monitoring both pressure magnitude and distribution within your wafer bonding device with Fujifilm Prescale^® wafer defects and can sharply reduced.

When placed in your wafer bonder, the film instantaneously and permanently changes color in direct proportion to the actual pressure applied. Philosophically similar to the indication given by Litmus paper. Precise pressure magnitude is then easily determined by comparing the resultant color intensity to a standardized color correlation chart No training or instrumentation is required.

Have you ever needed to evaluate pressure or force between two touching or mating surfaces? Previously, your only alternatives were strain gauges and load cells, that are both time consuming and difficult to interface. Now with the advent of our disposable one-time use pressure film, Fujifilm Prescale^®, evaluating surface contact pressure distribution and magnitude is accurate, quick and highly economical.