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Bond tool pressure inconsistencies
Bond tool pressure inconsistencies
Bond tool shows improvement in pressure uniformity
Bond tool shows improvement in pressure uniformity
Comparison of TiWAu half wafer on left and NbAu half wafer right
Comparison of TiWAu half wafer on left and NbAu half wafer right
Fabrication of CAP wafers for bonding tests
Fabrication of CAP wafers for bonding tests
gold pad pressed flat on bond pad
gold pad pressed flat on bond pad
gold stud bump top surface flattened by pressure
gold stud bump top surface flattened by pressure
Measured gap between wafers after bonding
Measured gap between wafers after bonding
Missalignment of wire bond 2
Missalignment of wire bond 2
Missalignment of wire bonder 1
Missalignment of wire bonder 1
pressure variations across a semiconductor wafer
pressure variations across a semiconductor wafer
seed metal bonding results
seed metal bonding results
Solder spilled outside of seed netal area after bonding
Solder spilled outside of seed netal area after bonding
Wafer Bonding German
Wafer Bonding German
Wafer Bonding 01
Wafer Bonding 01
Wafer Bonding 02
Wafer Bonding 02
Wafer Bonding 03
Wafer Bonding 03
Wafer Bonding precess
Wafer Bonding precess
Wafer Polishing
Wafer Polishing