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experimental setup Pressure Sensitive film between top and bottom mold
experimental setup Pressure Sensitive film between top and bottom mold
Flip Chip on PCB
Flip Chip on PCB
flow front after filling of glob top space
flow front after filling of glob top space
lamination wrinkles
lamination wrinkles
MAP moulding on FR 4 board
MAP moulding on FR 4 board
Mold tool and PCB substrate with film gate
Mold tool and PCB substrate with film gate
Nip roller pressure in PCB lamination press
Nip roller pressure in PCB lamination press
nip roller pressure profile in lamination press
nip roller pressure profile in lamination press
nip rolls uniform pressure
nip rolls uniform pressure
nip roller bending
nip roller bending
open circuit defects
open circuit defects
post lamination wrinkles
post lamination wrinkles
Pressure distribution during MAP moulding
Pressure distribution during MAP moulding
pressure drops with increasing distance to the film gate
pressure drops with increasing distance to the film gate
pressure graph recorded by Kistler pressure sensor
pressure graph recorded by Kistler pressure sensor
Properly aligned laminator
Properly aligned laminator
rolls low pressure
rolls low pressure
single flip chip on PCB encapsulation process
single flip chip on PCB encapsulation process