Free Sensor Sample Order Now
Image Gallery

SPI Image Gallery

« Back  |Page: 1

experimental-setup- Pressure Sensitive film between top and bottom mold

Flip Chip on PCB

flow front after filling of glob top space

lamination wrinkles

MAP moulding on FR-4 board

Mold tool and PCB substrate with film gate

Nip roller pressure in PCB lamination press

nip roller pressure profile in lamination press

nip rolls uniform pressure

nip-roller bending

open circuit defects


Pressure distribution during MAP moulding

pressure drops with increasing distance to the film gate

pressure graph - recorded by Kistler pressure sensor

Properly aligned laminator

rolls low pressure

single flip chip on PCB encapsulation process