FUJIFILM Measurement Film Solutions for Smartphones

FUJIFILM PRESCALE

Pressure measurement film

THERMOSCALE

Heat distribution measurement film

Example uses of PRESCALE / THERMOSCALE for parts manufacturing

Fujifilm Prescale Film Placed on a Battery Lamination Press

A - Camera Modules

Pressure Heat

Check Contact and heat distribution during ACF bonding

B - Semiconductor wafers

Pressure Heat

Uniform pressure and check heat distribution when wafers are joined

B - Ceramic laminated device filter

Pressure Heat

Check contact of molds for laminators               

Check uniform pressure and heat distribution for laminators

B - Print circuit boards

Pressure

Squeegee pressure distribution measurement during cream solder printing

Check dry film resist (DFR) laminated nip pressure and heat distribution

B - Semiconductor chips

Pressure

Die collect adjustmet for die bonding

C - Li-ion batteries

Pressure Heat

Check nip pressure and heat distribution for electrode plate press

Check aluminum laminate film crimping equipment conctact and heat distribution (Heat sealing)

Check contact for cathodes/separators/anode laminating equipment

Other parts

Flash memory

  • Check balancing during multilayer circuit board mounting process
  • Adjusting the molds when manufacturing the semiconductor package

Crystal transducers

  • Check contact when cutting crystal
  • Adjusting the cutting equipment

Connectors

  • Check contact for injection molding machine molds

Utilizing PRESCALE in LCDs, touch panel manufacturing and the smartphone assembly process

Prescale measurement results

  • AFC Bonding
  • OCA/cover glass lamination
  • Backlight lamination - smartphone lamination
  • Lithium-ion battery electrode plate press

Utilizing THERMOSCALE in LCDs, touch panel manufacturing and the smartphone assembly process

Use THERMOSCALE for processes that use heat to check the distribution

  • Check rough heat distribution during ACF bonding
  • Check the wiring pattern and heat loss during circuit board design

LCD Process

  • Polarization plate lamination Pressure
  • Driver IC ACF bonding Pressure Heat
  • Backlight Lamination Pressure
  • Small and medium LCD modules Pressure

Smartphone Assembly Process

  • ACF Bonding Pressure Heat
  • OCA Lamination Pressure

Touch Panel Process

  • Controller IC ACF bonding Pressure Heat
  • Touch panel / OCA lamination Pressure
  • Touch panel / cover glass lamination Pressure