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Bond tool pressure inconsistencies

Bond tool shows improvement in pressure uniformity

Comparison of TiWAu half-wafer on left and NbAu half-wafer right

Fabrication of CAP wafers for bonding tests

gold pad pressed flat on bond pad

gold stud bump top surface flattened by pressure

Measured gap between wafers after bonding

Missalignment of wire bond 2

Missalignment of wire bonder 1

pressure variations across a semiconductor wafer

seed metal bonding results

Solder spilled outside of seed netal area after bonding

Wafer Bonding - German

Wafer Bonding 01

Wafer Bonding 02

Wafer Bonding 03

Wafer Bonding precess

Wafer Polishing