Multilayer ceramic devices are manufactured by overlaying numerous paste-covered green sheets on which electrodes are printed, and then contact bonding the sheets together using a stacking machine. This process requires extremely high precision, to avoid changes in electrical characteristics due to problems of poor adhesion or non-uniform thickness, and to avoid electrical connection failures due to displacement of the electrode pattern. In addition, when the sheets are thin, non-contact areas tend to occur during stacking, making it necessary to check the mold contact even more stringently. Furthermore, as multilayer products become larger and larger over time, ensuring a uniform pressure balance is increasingly difficult. For this reason, adjusting the displacement and inclination of the stacking machine molds to ensure a uniform pressure balance before sheet stacking, has become an issue of the highest priority.