Fujifilm Prescale - Lamination Pressure Wafer

PRESCALE
MEASURED OBJECTS
USES
BENEFITS
INDUSTRY
Semiconductor production
APPLICATIONS
Verifying backgrind tape lamination pressure uniformity
CHALLANGES
The process for laminating backgrind tape (protective film) precedes grinding. If the lamination roller pressure distribution is not uniform, the backgrind tape can become wrinkled. If the height of the wafer and the surrounding mounting table are not optimal, wafer cracking and poor backgrind tape lamination occurs. Previously, only trail and error adjustment methods had been available to prevent this.
MEASUREMENT
Product used: Prescale (Extreme low pressure 4LW)
Prescale is placed on the wafer and the surrounding mounting table, after which the lamination roller is operated at the usual pressure. The Prescale is then removed and its color is examined to determine whether pressure had been uniformly applied.
PRESCALE
RESULTS
[Not good]
[Good]
BENEFITS OF PRESCALE

Time savings
Substantial improvements in equipment adjustment work efficiency.

Quality improvement
The ability to verify pressure uniformity in advance reduces losses resulting from poor quality. Wafer cracking is eliminated.

Without using Prescale
Wrinkles may cause loss of background tape, and wafer cracking may occur if the height adjustment of the wafer and the surrounding mounting table area is poor. The recovery process requires trial and error adjustments using actual lamination results. Tape, wafer and other losses occur, and time is required for adjustments, etc.
Using Prescale
Using Prescale, its is possible to verify the amount of pressure applied to the silicon wafer by the lamination roller under actual usage conditions. Only Prescale can show the pressure distribution under such conditions. Furthermore, the ability to preiodically check the uniformity of pressure results in adjustment time and material loss savings.